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X-WR-CALDESC:Events for Columbia Entrepreneurship
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DTSTART:20180101T000000
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DTSTART;VALUE=DATE:20190929
DTEND;VALUE=DATE:20190930
DTSTAMP:20260509T212904
CREATED:20190916T203903Z
LAST-MODIFIED:20190916T203903Z
UID:18509-1569715200-1569801599@entrepreneurship.columbia.edu
SUMMARY:Application Deadline: Hack3D
DESCRIPTION:Open to students \nApply here \n\nHack3D is one of CSAW’s latest cybersecurity competition with an aim to raise awareness in both scientific and manufacturing communities about the need for anti-counterfeiting methods in 3D printing. \nStudents who are interested in CAD solid modeling\, reverse-engineering\, and rapid prototyping are highly encouraged to register. \nInstructions for the Qualification Round below: \nStep 1: Review the Rules & Guidelines (https://csaw.engineering.nyu.edu/hack3d/rules-guidelines) if this has not already been done \nStep 2: Reconstruct a solid 3D model based on the given XYZ coordinates and layer thickness\n2a: The XYZcoordinates.txt file (attached) contains the X\, Y\, and Z toolpath coordinates for each row\, starting from the first point and ending with the last point\n2b: The layer height is 0.1 mm\n2c: Model reconstruction should be submitted as an STL file \nStep 3: Save and submit your responses in the form of a PDF file or presentation slides. It should explain your approaches\, provide details on any software\, program\, method or self-developed algorithm that you used\, and the difficulties you’ve come across/overcome during the reconstruction process if applicable.\nStep 4: Submit your responses and the STL model via email to csaw-3D@nyu.edu. \n\nDeadline: 29 September 2019\, 11:59 PM EST \n\nCash prizes per team at the Final: \n1st – $1000 \n2nd – $750 \n3rd – $500
URL:https://entrepreneurship.columbia.edu/event/application-deadline-hack3d/
CATEGORIES:NYU
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