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X-WR-CALDESC:Events for Columbia Entrepreneurship
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DTSTART;VALUE=DATE:20190929
DTEND;VALUE=DATE:20190930
DTSTAMP:20260408T213942
CREATED:20190916T203903Z
LAST-MODIFIED:20190916T203903Z
UID:18509-1569715200-1569801599@entrepreneurship.columbia.edu
SUMMARY:Application Deadline: Hack3D
DESCRIPTION:Open to students \nApply here \n\nHack3D is one of CSAW’s latest cybersecurity competition with an aim to raise awareness in both scientific and manufacturing communities about the need for anti-counterfeiting methods in 3D printing. \nStudents who are interested in CAD solid modeling\, reverse-engineering\, and rapid prototyping are highly encouraged to register. \nInstructions for the Qualification Round below: \nStep 1: Review the Rules & Guidelines (https://csaw.engineering.nyu.edu/hack3d/rules-guidelines) if this has not already been done \nStep 2: Reconstruct a solid 3D model based on the given XYZ coordinates and layer thickness\n2a: The XYZcoordinates.txt file (attached) contains the X\, Y\, and Z toolpath coordinates for each row\, starting from the first point and ending with the last point\n2b: The layer height is 0.1 mm\n2c: Model reconstruction should be submitted as an STL file \nStep 3: Save and submit your responses in the form of a PDF file or presentation slides. It should explain your approaches\, provide details on any software\, program\, method or self-developed algorithm that you used\, and the difficulties you’ve come across/overcome during the reconstruction process if applicable.\nStep 4: Submit your responses and the STL model via email to csaw-3D@nyu.edu. \n\nDeadline: 29 September 2019\, 11:59 PM EST \n\nCash prizes per team at the Final: \n1st – $1000 \n2nd – $750 \n3rd – $500
URL:https://entrepreneurship.columbia.edu/event/application-deadline-hack3d/
CATEGORIES:NYU
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20171030
DTEND;VALUE=DATE:20171101
DTSTAMP:20260408T213942
CREATED:20171016T205305Z
LAST-MODIFIED:20171016T205305Z
UID:10975-1509321600-1509494399@entrepreneurship.columbia.edu
SUMMARY:Future Labs AI Summit
DESCRIPTION:OPEN TO ALL \nRSVP HERE \nTwo days of trainings\, talks\, and panel discussions with leading experts\, investors\, academics\, and entrepreneurs in artificial intelligence (AI). \nFrom deep dives into the subjects animating AI conversations today — ethics and governance\, how to see through the hype and discover the best investments — to introductory courses in machine learning and game theory for AI\, the Future Labs AI Summit features offerings for scholars\, practitioners\, and investors alike.
URL:https://entrepreneurship.columbia.edu/event/future-labs-ai-summit/
CATEGORIES:NYU
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