Open to students
Apply here
Hack3D is one of CSAW’s latest cybersecurity competition with an aim to raise awareness in both scientific and manufacturing communities about the need for anti-counterfeiting methods in 3D printing.
Students who are interested in CAD solid modeling, reverse-engineering, and rapid prototyping are highly encouraged to register.
Instructions for the Qualification Round below:
Step 1: Review the Rules & Guidelines (https://csaw.engineering.nyu.
Step 2: Reconstruct a solid 3D model based on the given XYZ coordinates and layer thickness
2a: The XYZcoordinates.txt file (attached) contains the X, Y, and Z toolpath coordinates for each row, starting from the first point and ending with the last point
2b: The layer height is 0.1 mm
2c: Model reconstruction should be submitted as an STL file
Step 3: Save and submit your responses in the form of a PDF file or presentation slides. It should explain your approaches, provide details on any software, program, method or self-developed algorithm that you used, and the difficulties you’ve come across/overcome during the reconstruction process if applicable.
Step 4: Submit your responses and the STL model via email to csaw-3D@nyu.edu.
Deadline: 29 September 2019, 11:59 PM EST
Cash prizes per team at the Final:
1st – $1000
2nd – $750
3rd – $500